“"Hardware development is still too slow, we are changing that," is the motto of this local startup, which reduces circuit design processes that used to take months to just days with its System-in-Package (SiP) technology. This technology, which combines processor, memory, and power management in a single package, promises plug-and-play ease and industrial power in every field, from the defense industry to wearable technologies.
While software is evolving at a dizzying pace in the technology world, the hardware side is still struggling with the complex engineering processes of the 1990s. Engineers who want to develop an electronic product spend months drawing DDR memory buses, adjusting precise power sequences, and dealing with multilayer PCB (Printed Circuit Board) designs. However, the ITU Seed ecosystem has given rise to... Corezzle Electronics, This is poised to fundamentally change this challenging process.
The ones they developed System-in-Package (SiP) In other words, with its "System-in-Package" technology, Corezzle makes hardware development as fast, modular, and accessible as software development.
The New Definition of Hardware: “Generative Hardware”
Corezzle's vision is not just to produce a chip, but to build a global "generative hardware" ecosystem. The company's approach is based on transforming complex electronic components into modules that can be assembled like LEGO pieces.
In the traditional method, the processor, RAM, storage unit (eMMC), and power management integrated circuits (PMIC) are placed separately on the motherboard; with Corezzle technology, these are compressed into a single BGA (Ball Grid Array) package.
- Conclusion: Instead of dealing with complex signal paths, engineers can now get their products up and running in days by simply connecting their sensors to this "Package Chip".
- Advantage: The time from prototyping to mass production is shortened, production costs are reduced, and products become much more compact.
What is SiP (System-in-Package)?
The foundation of Corezzle's technology System-in-Package (SiP); It is created by combining multiple integrated circuits (processor, memory, sensors) and passive components within a single protective casing. It is a high-density hardware architecture.
This technology, which brings together components traditionally scattered across the motherboard into a single central location, provides engineers and manufacturers with three critical advantages:
- Space Saving: It makes it possible for devices to be much smaller and lighter.
- Energy Efficiency: Since the distance between components is reduced to the micron level, power loss in data transmission is decreased.
- Simple Card Design: Because complex circuit paths are resolved within the package, motherboard design is simplified and production is accelerated.
Industrial Power, Minimal Size
Corezzle is entering the market with three main product lines developed to meet the needs of different sectors. The common features of these products are high performance, thermal optimization, and minimal size.
The Cycle of Industrial Automation: NAR-3358™
Designed for factories, power plants, and challenging field conditions, this module is not only 30×30 mm in size.
- Strength: It features a Texas Instruments Sitara™ AM335x processor and up to 1 GB of DDR3L memory.
- Endurance: It can operate without problems in extreme temperatures ranging from -40°C to +85°C.
- Area of Use: Industrial automation serves as an ideal "brain" for smart factories and embedded systems.
The Power That Takes Artificial Intelligence to the Edge: NAR-32MP2x™
This module, developed to enable artificial intelligence (AI) applications to run on the device (Edge AI) without going to the cloud, is not only... 18×18 mm A technological marvel of its size.
- AI Performance: Thanks to its Neural Processing Unit (NPU) 1.35 TOPS It offers performance of (trillions of operations per second). This enables image processing and complex analyses to be performed instantly on the device.
- Processor Power: With its dual-core Arm® Cortex®-A35 and auxiliary M33 core, it delivers both high performance and energy efficiency.
The Heart of Wearable Technology: NAR-ESP32S3™
Designed for the Internet of Things (IoT) and wearable technologies, this module stands out with its low power consumption.
- Connection: It offers Wi-Fi and Bluetooth 5.0 features in an 18x18 mm package.
- Energy: With Li-Po battery charging support and an ultra-low power auxiliary processor, it fits into everything from smartwatches to health trackers.
From the Defense Industry to Start-ups: Who Will Use It?
Corezzle's modular structure appeals to a wide range of users:
- Defense Industry: Space and weight savings are vital in UAVs, UCAVs, and smart munitions. Corezzle modules, with their industrial-grade construction, increase the proportion of domestically produced components in defense projects.
- Hardware Startups: Instead of spending a large portion of their R&D budget on hardware design, entrepreneurs who want to develop a new device can quickly turn their ideas into products by using Corezzle modules.
- OEM Manufacturers: Original Equipment Manufacturers (OEMs) gain the advantage of bringing products to market faster by accelerating their integration processes.
Modular Hardware such as Software Libraries
Corezzle's vision is to bring hardware development to the "library" level of the software world. Just as a software developer uses ready-made libraries instead of writing code from scratch, a hardware developer can design their own device using Corezzle SiP modules.
This approach, combined with full support for operating systems like Yocto Linux and Android, signals that Türkiye can become a global player not only in software but also in deep tech hardware production.
With a wide range of applications from autonomous vehicles and robotics systems to smart cameras and language translation devices, Corezzle is opening a new chapter in the engineering world with its motto: "Less complexity, more productivity.".
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